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              Saft's technology to gain market share in Hong Kong and China 12/7/2014
              Hong Kong, December 5, 2014 - Saft, the world''s leading designer and manufacturer of advanced technology batteries for industry, is forging ahead in high-growth Asian markets, particularly China, largely thanks to its much-appreciated ability to man...
              Infineon Introduces the TO-247 4 Kelvin-Sense Package for Discrete IGBTs 11/14/2014
              - Infineon Defines New Levels of Low Switching Losses and High Power Density ...
              Belden's New Molded Cord Sets Support High-Speed Network Connections 11/13/2014
              Lumberg Automation M12 Cord Sets Ensure High Data Volume Transfers in Industrial Ethernet Applications ...
              Evonik and Holst Centre enter next phase of joint partnership introducing iXsenic technology into mass production 9/30/2014
              Over the last two years, Holst Centre supported Evonik in optimizing material and process of the new semiconductor technology iXsenic® S. Now the cooperation enters the next phase by extending the contract and introducing the revolutionary techn...
              E2 micro from igus: supplying energy made easy 9/12/2014
              Free chain opener for lightning fast assembly included with each delivery ...
              5853 Series 0.35mm Pitch Board to Board Connector with Stacking Height of 0.6mm Launched 9/3/2014
              This news release is intended for media purposes, and is current of the date of publication. Information is subject to change without notice. ...
              Development of "High Performance Magnetic Core" for Induction Hardening Equipment 8/29/2014
              Composite material with proprietary mix, and special compression molding technology for the industry highest performance ...
              Belden Adds Pre-Terminated Fiber Connectivity Products to Its Data Center Solutions Range 8/28/2014
              New FiberExpress Pre-Terminated LSNH Assemblies and Ultra High-Density Rack-Mount Fiber Connectivity Systems Facilitate Easier Installation, Faster Deployment, and Greater Flexibility ...
              TE CONNECTIVITY AND INTERCONTEC ANNOUNCE CO-BRANDING FOR JAPAN 8/15/2014
              New agreement for circular metric connectors delivers benefits for Japanese industrial customers ...
              A world first: chainflex cables with "German Lloyd" certificate 6/9/2014
              New test standard for cables in motion control applications guarantees reliability in maritime applications. ...
              AGC Succeeds in Rolling SPOOL™, a 0.05 mm-thick Sheet Glass 5/30/2014
              Resulting in a 1,150 mm-wide, 100 m-long roll of the world's thinnest float glass ...
              Infineon presents Slew Rate Control EiceDRIVER™ - Developed for the most demanding industrial applications up to 1200 V 5/27/2014
              Neubiberg, May 20, 2014 - At this year''s PCIM trade fair Infineon Technologies AG will present for the first time the single channel gate driver of the latest EiceDRIVER™ product family, developed especially for high-end systems in the industr...
              STMicroelectronics Ships Milestone STM8 Microcontroller 5/23/2014
              Fast ramp to one billionth device, demonstrates market focus and continuing commitment to 8-bit market ...
              TE Connectivity extends industrial mini i/o connector portfolio with field installable version 5/22/2014
              Newly Launched Version Allows for Easier Installation in the Field Without Complicated Wire Termination ...
              Jungheinrich Presents Powerhouse of Innovations at CeMAT 5/20/2014
              The Hamburg-based Jungheinrich group is presenting numerous innovations and product refinements at CeMAT 2014 - from May 19 to 23 in Hanover, Germany - where visitors will find a comprehensive array of logistics systems, stackers and intralogistics s...
              ThinPAK 5x6 Brings Smallest CoolMOS™ MOSFETs Ever into Adapters, Consumer Electronics and Lighting Applications 5/17/2014
              Neubiberg, Germany - May 15, 2014 - Infineon Technologies today introduces a new leadless surface mounted (SMD) package for CoolMOS ™ MOSFETs named ThinPAK 5x6. ...
              HOLTEK BS82D20A-3 New Touch Flash MCU 5/13/2014
              Following the successful release of the BS82C16A-3, Holtek is now delighted to announce the release of a new Touch Key Flash MCU with LED/LCD Driver, the BS82D20A-3. ...
              igus Simply plugged-in: The readychain speed 5/9/2014
              The new plug-in energy chain "readychain speed" connects harnessed e-chainsystems within seconds and without the need for tools. ...
              Blast Motion Launches First Product Blast Baseball and Debuts New Website 5/8/2014
              Blast''s Precision Motion Sensor technology brings baseball and softball players new ways to track, share and compare their game ...
              Synopsys DFTMAX Ultra Deployed By Dialog Semiconductor to Successfully Test Silicon Parts 5/7/2014
              Delivers 3X Higher Test Compression and Ease-of-Deployment ...

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